MSASPL provides humidity and damp heat testing support to evaluate how electronic and electrical products behave under controlled high-humidity conditions. Moisture exposure can influence insulation resistance, PCB assemblies, connectors, coatings, sensors, displays, adhesives and corrosion-sensitive interfaces.
What is humidity / damp
heat testing?
Humidity testing conditions a DUT at a defined temperature and relative humidity for an agreed period. Depending on the requirement, the profile may be steady-state or cyclic. The objective is to evaluate resistance to moisture-related effects during storage, transportation or use.
Why humidity testing
matters
High humidity can promote leakage currents, insulation degradation, corrosion, swelling of hygroscopic materials, connector instability and sensor drift. Early evaluation helps identify vulnerable materials, interfaces and protective measures.
Typical issues that
can be observed
Suitable products and applications
How MSASPL can structure the evaluation
Standards and test-plan
reference
Possible references include IEC 60068-2-78:2025 for damp heat, steady state, and IEC 60068-2-30:2025 for damp heat, cyclic. The correct method depends on whether the requirement calls for constant high humidity, cyclic temperature changes and/or condensation.
Frequently Asked Questions
